Enable Technologies for Leading-edge Space Applications


21 Sept.			14:00 - 15:30



CHIPS & MICRO-NANO ELECTRONICS

TT.VII - Technical Multi-Track with Parallel SYMPOSIA
Enable Technologies for Leading-edge Space Applications
Co-organized with Thales Alenia Space Chair: Mirko ROCCI, Thales Alenia Space
The symposium aims to explore the integration of cutting-edge technologies such as Additive Layer Manufacturing (ALM), Printed Circuit Board (PCB) designs, System-in-Package (SiP) architectures, nanotechnologies, and superconductors, and their pivotal role in advancing space applications. State-of- the-art ALM utilizes nanomaterials (i.e. 2D crystals) to enhance material properties, while advanced PCB designs improve signal integrity, radiation tolerance, and reliability in the space environment. SiP architectures employ high density interconnects (HDI), packaging techniques, and advanced materials to achieve higher levels of miniaturization, power efficiency, and enhanced system performance. Furthermore, the integration of nanotechnologies and superconductors modifies the electrical and optical properties of various materials, resulting in enhancements in conductivity, bandgap engineering, and optoelectronic properties that could become strategic for future space applications. The symposium will feature presentations from experts in the field providing insights into scalability, manufacturing techniques, and compatibility considerations, paving the way for further advancements in space technology integration. It is an excellent opportunity for students and professionals in the space industry to learn about the latest advancements and to connect with like-minded individuals.

TT.VII.G.1	Mirko ROCCI Thales AleniaSpace Enhancing Performance of Space-Qualified Materials through Bulk Doping and Coating based on Two-Dimensional Crystals
TT.VII.G.2	Giovanni CUCINELLA IMT srl Advancements in System-in-Package Technology for Future Space Equipment
TT.VII.G.3	Nicola AVERSANO Smart materials: application to transparent material in Space window
TT.VII.G.4	Nicola AVERSANO 3D FDM-printing: application of tecnopolymers to space structures
TT.VII.G.5	Nicola AVERSANO Challenges of AM in space application: NDI and standardization